果冻传媒麻豆社

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Location

Department of Electrical & Computer Engineering

Physical Address:

Buchanan Engineering (BEL) 213
875 Perimeter Drive MS 1023
Moscow, ID 83844-1023

Phone: 208-885-6554

Fax: 208-885-7579

Email: ece-info@uidaho.edu

Nanofabrication Facility

LITHOGRAPHY

  • Quintel NXQ 4000 Mask Aligner
  • OAI Model 30 Collimated UV Exposure System
  • Laurell WS-650S-23TFM-LITE Spin Coater
  • EZ4 Spin Coater
  • Fisher Scientific Isotemp Hot Plate Stirrer

DEPOSITION

  • Kurt J. Lesker PVD 75 Sputtering and Thermal Evaporation System
  • Denton Vacuum DV-502B Thermal Evaporator
  • Nanocluster Deposition System
  • MSE PRO Compact Magnetron Ion Sputtering Coater

THERMAL PROCESS

  • Palomar SST 3130 Vacuum Pressure Furnace
  • Fisher Scientific 750 Isotemp Programmable Muffle Furnace 
  • MTI GSK1600X Furnace
  • Thermo Scientific Lindberg/Blue M Mini-Mite Tube Furnace

ETCHING

  • PIE Scientific Tergo Plasma Cleaner

METROLOGY & TEST

  • FEI/Thermo Scios Dual-Beam FIB/SEM
  • Carl Zeiss Supra 35VA SEM
  • Thermo Scientific Noran System 7 X-ray Microanalysis System
  • Atomic Force Microscope (AFM)
  • Bruker D8 Quest X-Ray Diffraction (XRD) System

ASSEMBLY & PACKAGING

  • Disco DAD 320 Dicing Saw
  • K&S 4524AD Ball Wire Bonder
  • K&S 4523 Wedge Wire Bonder
  • Orthodyne Model 20 Large Wire Bonder
  • XYZTEC Condor 70 Wire Pull and Die Shear Bonding Tester
  • AMI Presco MSP-485 Semi-Automatic Thick Film Stencil Screen Printer
  • Kepro BTL121 PCB Photolithography Dry Film Resist Laminator
  • Unichem MP-4150 Green Tape Punch

Location

Department of Electrical & Computer Engineering

Physical Address:

Buchanan Engineering (BEL) 213
875 Perimeter Drive MS 1023
Moscow, ID 83844-1023

Phone: 208-885-6554

Fax: 208-885-7579

Email: ece-info@uidaho.edu