3D Imaging and Printing Lab
Welcome to the 果冻传媒麻豆社 3D Imaging and Printing Lab
Located in the U of I's Integrated Research and Innovation Center, the 3D Imaging and Printing Lab features state-of-the-art 3D scanning and printing capabilities that take advantage of modern X-ray technology. The scanner and printer were purchased with funding from the National Science Foundation (NSF) MRI program, , and the .
Questions about the lab? Please contact the Director, Tao Xing, Ph.D., P.E., Professor of Mechanical Engineering by email or by phone at: 208-885-9032
Physical Address:
Integrated Research & Innovation Center (IRIC), Room 221
685 South Line Street, Moscow ID. 83844
Mailing Address:
果冻传媒麻豆社
875 Perimeter Dr. MS 1122
Moscow, ID. 83844-1122
Web: uidaho.edu/3dip | Lab Phone: 208-885-1227
| Feature | Specification | Benefit |
|---|---|---|
| X-ray source | 40 鈥� 100 kV 10 W 5 碌m spot size at 4 W |
Maintenance-free sealed X-ray source Fast scans for QC, or 4D XRM |
| X-ray detector | Active pixel CMOS flat-panel 3 MP (1944 x 1536) 75 碌m pixel size |
Excellent signal-to-noise Large Field-of-View |
| Object size | 96 mm diameter 120 mm height |
Capable to scan a large range of sample sizes |
| Sample changer (optional) |
16 samples up to 50 mm diameter 8 samples up to 96 mm diameter External access |
Unattended high throughput Any combination of large and small samples Add/remove samples at any time without interrupting the actual scan |
| Dimensions | W 1040 mm x D 665 mm x H 400 mm Weight 170 kg |
Space-saving desktop system that fits in every lab |
| Power supply | 100-240V AC, 50-60Hz, 3A max | Minimum installation requirements, a standard power supply suffices |
| Model Materials |
|
|---|---|
| Digital Model Materials |
|
| Support Materials | SUP705鈩� (water jet removable) SUP706B鈩� (soluble) |
| Build Size | 490 x 390 x 200 mm (19.3 x 15.35 x 7.9 in.) |
| Layer Thickness | Horizontal build layers down to 14 microns (0.00055 in.) 55 microns (0.002 in.) in Super High Speed1 mode |
| Workstation Compatibility | Windows 10 |
| Network Connectivity | LAN 鈥� TCP/IP |
| System Size and Weight | System: 1400 x 1260 x 1100 mm (55.1 x 49.6 x 43.4 in.); 430 kg (948 lbs.) Material Cabinet: 1119 x 656 x 637 mm (44 x 25.8 x 25.1 in.); 153 kg (337 lbs.) |
| Operating Conditions | Temperature 18 鈥� 25 掳C (64 鈥� 77 掳F); relative humidity 30-70% (non-condensing) |
| Power Requirements | 100鈥�120 VAC, 50鈥�60 Hz, 13.5 A, 1 phase 220鈥�240 VAC, 50鈥�60 Hz, 7 A, 1 phase |
| Regulatory Compliance | CE, FCC, EAC, RCM, R-NZ |
| Software | GrabCAD Print |
| Build Modes | High Quality: up to 7 base resins, 14-micron (0.00055 in.) resolution High Mix: up to 7 base resins, 27-micron (0.001 in.) resolution High Speed: up to 3 base resins, 27-micron (0.001 in.) resolution Super High Speed: 1 base resin, 55-micron (0.002 in.) resolution |
| Accuracy | Typical deviation from STL dimensions, for models printed with rigid materials, based on size: under 100 mm 鈥� 卤100渭; above 100 mm 鈥� 卤200渭 or 卤 0.06% of part length, whichever is greater. |
Scanning Job Application Process
- Fill in the scanning application form (above)
- Send the form and sample* to xing@uidaho.edu
- You will receive a quote for the cost
- If cost agreed, sign and send the form back
- We will send you the scanned images via cloud
Printing Job Application Process
- Fill in the printing application form (above)
- Send the form and geometry* to xing@uidaho.edu
- You will receive a quote for the cost
- If cost agreed, sign and send the form back
- We will send you the printed object (external customers are responsible for shipping cost)
*If sample/geometry is confidential, indicate in the email and request a Non-Disclosure Agreement (NDA)